By American Welding Society (auth.)
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Additional info for Soldering Manual
Wave Shapes A solder wave is characterized by its width, a dimension perpendicular to the direction of travel (also called length); height from nozzle edge to apex or top; geometrical contact length between workpiece and wave, referred to also as the width of the contact band or the width of the area of contact. The contact length and speed of travel will determine the dwell time: the time during which a printed circuit board or other workpiece is in contact with the solder. ). 5 to I m/min ( ""2 to 4 ft/min).
Hot dipping may be accomplished by dipping the parts, one at a time, in molten tin or solder of any composition. Small parts are placed in a wire basket, cleaned, dipped in the molten metal, and rotated in a centrifuge to remove excess metal. Hot dipped coatings can be applied to carbon steel, alloy steel, cast iron, copper and certain copper alloys and, to a lesser extent, brass and aluminum. Precoating by electrodeposition may be done in stationary tanks, conveyorized plating units, or in barrels.
Jr. 1961. Printed circuits handbook. New York: McGraw-Hill. 3. D. and Martin, L. 1970. Improving control of soft soldering in copper piping joints. In ASME Paper 70-PVP-21. 4. T. 1973. Reflow soldering ofinteg- 5. 6. 7. 8. rated circuit flatpacks. Welding journal, 52, 1: 23-30. H. 1964. Solders and soldering New York: McGraw-Hill. B. 1971. Solder joints vs. time and temperature. Machine design, April 15. M. 1965. Soldering in the electronic industry. British welding journal, 12, 12. TRI Publication 369, 1965.